Welcome to Book Our MTK Solution of AI Glasses /Android 13

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SoC main chip descriptions
SoC chip: MTK8667 12nm 2-core Cortex-A75 @2.0GHz. 6-core Cortex-A55 @1.8GHz
ROM: 64GB
RAM:  4GB LPDDR#
WIFI:  802.11 b/g/n 2.4G
Operating system:  Android 13
size: 11X11.8 mm VFBGA
Bluetooth:  Built-in: BT5.0/BLE
Wi-Fi: WIFI5 802.11 b/g/n/ac
GPS
Camera:  IMX681/12M
Video output pixels/frame rate: The video defaults to 1080p/30fps EIS
                                                    Landscape 1080p@30fps
                                                    720p@90fps (High-speed mode)
                                                    480p@120fps (Overspeed mode)
Video Recording: 12-megapixel prime lens, supporting 1080P 30fps recording
Sound Recording: Dual-channel WAV/MP3 recording
Quick keys: Supports quick start recording
Time regression:  After startup, it supports 30-minute backtracking (external recording mode)
Ai Assistant: Integrate with third-party large models to support photo recognition, photo text extraction,
image translation, and real-time object recognition and analysis
Voice command: Integrate third-party voice models and support voice wake-up and operation
Photo Album:  View the photos and video files captured by the glasses. You can operate on the current
page to delete and share files (share to mobile phones and other devices via Bluetooth).
Synchronize with the mobile phone app and manually download to the local album
Live streaming: Support local streaming
Gyroscope: Supporting
Audio -MIC: 1 MIC call
                       4 MIC noise reduction, ANC open adaptive noise reduction, AI noise reduction
Audio - Speaker: Left and right dual speakers AAC 0820
Interaction - Touch: The wearing sensation/The volume should be adjusted
Interaction - Voice control: Voice wake-up/voice control/shooting button
Indicator light: Supporting
W517 mainboard: UNISOCW517 smart wearable chip platform motherboard, Android 9, 2G/32G, Wi-Fi5/BT5, supports camera, 10-layer 2-stage hard board
Main frame cable arrangement: Light sensor /MIC/ camera /LED/ charging interface/power management/on/off switch, 6-layer blind buried hole flexible board
Right FPC:  IMU/MIC, 4-layer FPC
Microphone FPC:  MIC, double-deck FPC
 Antenna small FPC: 2.4G/5G dual-band antenna with GPS function
Bluetooth SoC Chip Description 
SoC Chip: BES2700H
Subsystem: STAR-MC1*4/ BECO 2.0NPU*4
ROM: 4MB
RAM: 2.2MB
Bluetooth: V5.4

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